VIA Secures $28M from Global Enterprises to Scale Its Decentralized Data and Identity Protection Platform
- Editor
- Mar 18
- 1 min read
Whats Happening:
VIA Science, Inc. has raised $28 million in Series B funding to accelerate the deployment of its high-security, decentralized data and identity protection platform. The investment was led by Bosch Ventures, with participation from BMW i Ventures, MassMutual Ventures, and Sentinel Global. VIA's platform, which uses a decentralized, zero trust architecture and quantum-resistant encryption, has been rigorously tested by the U.S. Department of Defense and is now poised for expansion in both defense and enterprise sectors.
Key Moves:
VIA raises $28 million in Series B funding
Bosch Ventures leads the investment round
Funding to accelerate adoption of VIA's decentralized, quantum-resistant platform
By The Numbers:
$28 million raised in Series B funding
18 issued patents backing VIA's technology
Quantum-resistant, passwordless platform
Key Quotes:
"This funding will accelerate adoption of the world's first military-grade Web3 data protection platform by large enterprise customers," - Colin Gounden, co-founder and CEO of VIA
"As the number one supplier across automotive and many industrial sectors, we're deeply familiar with the digital transformation taking place across supply chains." - Adam Jackson, Bosch Ventures partner
"VIA's solutions stand out with their decentralized Web3, quantum-resistant architecture by powering seamless interoperability across software connections and hardware endpoints." - Charles Svirk, Partner at MassMutual Ventures
Bottom Line:
VIA's successful $28 million Series B funding round underscores the growing demand for advanced, decentralized data protection solutions in both defense and enterprise sectors. With its quantum-resistant, passwordless technology already proven in demanding environments, VIA is well-positioned to set new standards in data and identity protection as it expands its reach in the civilian agency and enterprise markets.
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